Customized Electronic Component Blister Trays | Professional Manufacturer

Looking for the perfect packaging solution for your electronic components? We specialize in designing and manufacturing custom blister trays to precisely match the shape and size of your products. Whether it’s chips, connectors, or other delicate components, our custom solutions ensure their safety and integrity during transport and storage.

Application areas of electronic component plastic trays

Why choose our electronic products blister tray ?

Superior ESD (Electrostatic Discharge) Performance

Manufactured using specialized conductive or static-dissipative materials, our trays effectively control static buildup and discharge, providing reliable electrostatic safety protection for sensitive electronic components (e.g., chips, PCBs).

Ultra-High Precision Forming & Dimensional Consistency

Leveraging high-precision molds and stringent QC processes, the tray cavities have minimal dimensional tolerance. This ensures a perfect fit with your electronic components, preventing shifting and friction during transport and handling.

Compatibility with Automated Production Lines

The trays are designed to meet industrial automation standards, with optimized structure and flatness. They can be stably picked and transferred by SMT pick-and-place machines, robotic arms, or other automated equipment, boosting your production efficiency.

Physical Protection for Pins and Fragile Components

Customized cavity designs effectively isolate and suspend delicate connectors, pin headers, or leads, preventing bending, deformation, or damage during stacking, dropping, or transit.

Material Diversity and Functionality

We offer material options including PS, PET, and PVC with various properties such as impact resistance, high heat resistance, and different conductivity levels, meeting component requirements for cleanroom, chemical resistance, or specific temperature environments.

Stackability and Optimized Space Utilization

The tray edges and corners are precisely engineered for safe multi-layer stacking. This allows for optimal utilization of totes and warehouse space, significantly reducing logistics and storage costs.

High Cleanliness and Cleanroom Suitability

The manufacturing process is strictly controlled to ensure high surface cleanliness, minimizing particulates and dust. This makes the trays suitable for packaging optical/micro-electronic components where cleanroom environments and low contamination are strictly required.

Reliable Supply Chain and Mass Production Capability

As a large-scale manufacturer, we possess robust production capacity and material reserves, ensuring your high-volume orders are delivered on time and on quality, securing the continuity of your electronic product manufacturing needs.

FAQs about Electronic Product Blister Trays

How do your electronic blister trays achieve Electrostatic Discharge (ESD) functionality?

We use conductive or static-dissipative plastic materials (like anti-static PS or PET) during manufacturing. This controls the material’s surface resistivity to effectively dissipate static electricity, protecting sensitive components.

What levels of ESD protection do you offer?

We typically offer trays with different surface resistivity levels, including static-dissipative (10 ⁹ to 10 ¹¹ ohms) and conductive (10 ³ to ¹⁰ 6 ohms), to meet the sensitivity requirements of various components.

How do you ensure the dimensional accuracy of the trays?

We use high-precision CNC molds and perform strict inspections of key dimensions with professional optical measuring equipment after production, ensuring the tray pocket tolerances meet the high accuracy required for automated pickup.

What is the most common material used for electronic trays?

The most commonly used materials are anti-static PS (Polystyrene) and anti-static PET (Polyethylene Terephthalate). PET is gaining popularity in high-end applications due to its high clarity and better impact strength.

Are your blister trays suitable for automated SMT/Pick-and-Place lines?

Yes. Our trays are designed with attention to flatness, edge consistency, and dimensional tolerance to be fully compatible with the pick-and-place processes used on automated production lines.

What if my electronic components shake during transit?

This is a design issue. Our engineers will use your component CAD files to design closely fitting cavities and locking structures that securely hold the components, eliminating any shaking or movement during transit.

Can your trays be stacked in multiple layers?

Yes. Our trays feature specially designed load-bearing and stacking structures on the edges. They can be safely stacked in layers, maximizing storage and transport space without applying pressure to the components in the trays below.

Can you provide high-temperature resistant blister trays?

Yes, for components that require baking or burn-in testing, we can manufacture trays using high-temperature resistant materials (like specific PET or PC formulations) to withstand the required thermal processing.

How do you guarantee consistent ESD performance in mass-produced trays?

We perform incoming material inspection on every batch of anti-static material and conduct surface resistivity tests on randomly sampled finished trays during production to ensure batch-to-batch consistency in ESD performance.

Are your trays suitable for cleanroom environments?

Yes, we provide trays that undergo a high-cleanliness finishing process, with strictly controlled production to minimize dust, making them suitable for handling and packaging microelectronic, optical, and semiconductor components in cleanroom environments.

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